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M.2
The product is EOL (End Of Life)!
// M.2
// Kioxia 3D TLC
// PCI Express Gen. 3
// 3TE6
// 0°C to 70°C | -40°C to 85°C
Please configure your desired product.
Standard Configuration
Custom Configuration
Sales only to business customers.
Delivery time: upon request
Basic Module: Innodisk M.2 (P42) 3TE6
| General information | ||||
| SKU / Item Number | M.2 (P42) 3TE6DEM24-01TDD1ECAQF, DEM24-01TDD1EWAQF, DEM24-01TDD1GCAQF, DEM24-01TDD1GWAQF, DEM24-01TDD1KCAQF, DEM24-64GDD1ECADF, DEM24-64GDD1EWADF, DEM24-A28DD1ECAQF, DEM24-A28DD1EWAQF, DEM24-A28DD1GCADF, DEM24-A28DD1GWADF, DEM24-A28DD1KCADF, DEM24-B56DD1ECAQF, DEM24-B56DD1EWAQF, DEM24-B56DD1GCAQF, DEM24-B56DD1GWAQF, DEM24-B56DD1KCAQF, DEM24-C12DD1ECAQF, DEM24-C12DD1EWAQF, DEM24-C12DD1GCAQF, DEM24-C12DD1GWAQF, DEM24-C12DD1KCAQF, DEM24-01TDD1KWAQF, DEM24-A28DD1KWADF, DEM24-B56DD1KWAQF, DEM24-C12DD1KWAQF | |||
| Product Basic Data | ||||
| Manufacturer | Innodisk | |||
| Flash storage media | ||||
| Series | 3TE6 | |||
| Connection (Interface) | PCI Express Gen. 3 | |||
| Flash structure | M.2 (NGFF) | |||
| Key Type | M | |||
| Flash type | Kioxia 3D TLC | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
| Write/Erase cycles (P/E limit) | 3000 | |||
| Capacity | 1 TB, 64 GB, 128 GB, 256 GB, 512 GB | |||
| Controller | ID303 (MK1002 with Innodisk logo) | |||
| Channel | 2, 4 | |||
| Maximum current draw | 3,5 W | |||
| iPowerguard | is supported | |||
| NVMe | Yes | |||
| Temperature sensor | Yes | |||
| TRIM | is supported | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17), 96-Layer 3D Flash, 112/128 Layer 3D Flash | |||
| S.M.A.R.T. | Yes | |||
| Mechanical / Environment | ||||
| Temperature | Operation | 0°C to 70°C, -40°C to 85°C | ||
| Storage | -55°C to 95°C | |||
| Relative humidity | Operation | 10 to 95%, non-condensing | ||
| Dimensions | Form factor | M.2 | ||
| Type | 2242 | |||
| Interface | PCI Express 3.0 x 4 | |||
| Width | 22 mm | |||
| Deep | 42 mm | |||
| Height | 1,35 mm, 1,95 mm | |||
| Vibration | Vibration | 20G, 7-2000Hz, 3 axes | ||
| Reference Standard | IEC 68-2-6 | |||
| Shock | Measurement Data | 1500G, 0.5 ms, 3 axes | ||
| Reference Standard | IEC 68-2-27 | |||
| Weight | 7 g | |||
| MTBF (Mean Time Between Failures) | MTBF at 25°C | 3.000.000 h | ||
| Calculation model | Telcordia SR - 332 GB | |||
| Certificates / Conformities | ||||
| CE | Yes | |||
| RoHS compliant | Yes | |||
| End of Life (EOL) | |
| PCIe 3TE6 Controller Series EOL Notice Description Innodisk hereby announces that we will discontinue 3TE6 controller series products going forward. The 3TE6 successors for PCIe Gen3 Dramless solution are 3TE4 and 3TE8 as below. The products listed below will be phased out of production with a last purchase date: 2024/12/01. If your company's shipping date falls after the last purchase date, please help signing the NCNR agreement, innodisk will reserve the necessary materials you require. | |
| Revision: | F240043-14 |
| Revision date: | 1. September 2024 |
| Last purchase date: | 1. Dezember 2024 |
| Last shipping date: | 1. März 2025 |
| Affected Products: |
M.2 (P42) 3TE6, DECFX-01TDD1ECADFW, DECFX-01TDD1ECAQF, DECFX-01TDD1ECAQFW, DECFX-01TDD1EWADFW, DECFX-01TDD1EWAQF, DECFX-01TDD1EWAQFW, DECFX-01TDD1KCAQF, DECFX-01TDD1KCAQFW, DECFX-64GDD1ECADF, DECFX-64GDD1ECADFW, DECFX-64GDD1ECAQFW, DECFX-64GDD1EWADF, DECFX-64GDD1EWADFW, DECFX-64GDD1EWAQFW, DECFX-A28DD1ECADFW, DECFX-A28DD1ECAQF, DECFX-A28DD1ECAQFW, DECFX-A28DD1EWADFW, DECFX-A28DD1EWAQF, DECFX-A28DD1EWAQFW, DECFX-A28DD1KCADF, DECFX-A28DD1KCADFW, DECFX-A28DD1KCAQFW, DECFX-B56DD1ECADFW, DECFX-B56DD1ECAQF, DECFX-B56DD1ECAQFW, DECFX-B56DD1EWADFW, DECFX-B56DD1EWAQF, DECFX-B56DD1EWAQFW, DECFX-B56DD1KCAQF, DECFX-B56DD1KCAQFW, DECFX-C12DD1ECADFW, DECFX-C12DD1ECAQF, DECFX-C12DD1ECAQFW, DECFX-C12DD1EWADFW, DECFX-C12DD1EWAQF, DECFX-C12DD1EWAQFW, DECFX-C12DD1KCAQF, DECFX-C12DD1KCAQFW, DEM24-01TDD1ECAQF, DEM24-01TDD1ECCQF, DEM24-01TDD1EWAQF, DEM24-01TDD1EWCQF, DEM24-01TDD1GCAQF, DEM24-01TDD1GWAQF, DEM24-01TDD1KCAQF, DEM24-01TDD1KCAQL, DEM24-01TDD1KCCDF, DEM24-01TDD1KCCQF, DEM24-01TDD1KWAQF, DEM24-01TDD1KWCDF, DEM24-01TDD1KWCQF, DEM24-64GDD1ECADF, DEM24-64GDD1ECCDF, DEM24-64GDD1EWADF, DEM24-64GDD1EWCDF, DEM24-64GDD1KCCQF, DEM24-64GDD1KWCQF, DEM24-A28DD1ECAQF, DEM24-A28DD1ECCQF, DEM24-A28DD1EWAQF, DEM24-A28DD1EWCQF, DEM24-A28DD1GCADF, DEM24-A28DD1GWADF, DEM24-A28DD1KCADF, DEM24-A28DD1KCADL, DEM24-A28DD1KCCDF, DEM24-A28DD1KCCQF, DEM24-A28DD1KWADF, DEM24-A28DD1KWCDF, DEM24-A28DD1KWCQF, DEM24-B56DD1ECAQF, DEM24-B56DD1ECCQF, DEM24-B56DD1EWAQF, DEM24-B56DD1EWCQF, DEM24-B56DD1GCAQF, DEM24-B56DD1GWAQF, DEM24-B56DD1KCADL, DEM24-B56DD1KCAQF, DEM24-B56DD1KCAQL, DEM24-B56DD1KCCDF, DEM24-B56DD1KCCQF, DEM24-B56DD1KWAQF, DEM24-B56DD1KWCDF, DEM24-B56DD1KWCQF, DEM24-C12DD1ECAQF, DEM24-C12DD1ECCQF, DEM24-C12DD1EWAQF, DEM24-C12DD1EWCQF, DEM24-C12DD1GCAQF, DEM24-C12DD1GWAQF, DEM24-C12DD1KCAQF, DEM24-C12DD1KCAQL, DEM24-C12DD1KCCDF, DEM24-C12DD1KCCQF, DEM24-C12DD1KWAQF, DEM24-C12DD1KWCDF, DEM24-C12DD1KWCQF, DEM28-01TDD1ECAQF, DEM28-01TDD1ECCQF, DEM28-01TDD1EWAQF, DEM28-01TDD1EWCQF, DEM28-01TDD1GCAQF, DEM28-01TDD1GWAQF, DEM28-01TDD1KCAQF, DEM28-01TDD1KCAQL, DEM28-01TDD1KCCQF, DEM28-01TDD1KWAQF, DEM28-01TDD1KWCQF, DEM28-01TDD2KWAQF, DEM28-02TDD1ECAQF, DEM28-02TDD1ECCDF, DEM28-02TDD1ECCQF, DEM28-02TDD1EWAQF, DEM28-02TDD1EWCDF, DEM28-02TDD1EWCQF, DEM28-02TDD1GCAQF, DEM28-02TDD1GWAQF, DEM28-02TDD1KCAQF, DEM28-02TDD1KCCDF, DEM28-02TDD1KCCQF, DEM28-02TDD1KWAQF, DEM28-02TDD1KWCDF, DEM28-02TDD1KWCQF, DEM28-02TDD2KWAQF, DEM28-64GDD1ECADF, DEM28-64GDD1ECCDF, DEM28-64GDD1EWADF, DEM28-64GDD1EWCDF, DEM28-A28DD1ECAQF, DEM28-A28DD1ECCQF, DEM28-A28DD1EWAQF, DEM28-A28DD1EWCQF, DEM28-A28DD1GCADF, DEM28-A28DD1GWADF, DEM28-A28DD1KCADF, DEM28-A28DD1KCADL, DEM28-A28DD1KCCDF, DEM28-A28DD1KWADF, DEM28-A28DD1KWCDF, DEM28-A28DD2KWADF, DEM28-B56DD1ECAQF, DEM28-B56DD1ECCQF, DEM28-B56DD1EWAQF, DEM28-B56DD1EWCQF, DEM28-B56DD1GCAQF, DEM28-B56DD1GWAQF, DEM28-B56DD1KCADL, DEM28-B56DD1KCAQF, DEM28-B56DD1KCAQL, DEM28-B56DD1KCCQF, DEM28-B56DD1KWAQF, DEM28-B56DD1KWCQF, DEM28-B56DD2KWAQF, DEM28-C12DD1ECAQF, DEM28-C12DD1ECCQF, DEM28-C12DD1EWAQF, DEM28-C12DD1EWCQF, DEM28-C12DD1GCAQF, DEM28-C12DD1GWAQF, DEM28-C12DD1KCAQF, DEM28-C12DD1KCAQL, DEM28-C12DD1KCCQF, DEM28-C12DD1KWAQF, DEM28-C12DD1KWCQF, DEM28-C12DD2KWAQF, DHM24-20GDD1ECCDF, DHM24-20GDD1EWCDF, DHM24-40GDD1ECCQF, DHM24-40GDD1EWCQF, DHM24-80GDD1ECCQF, DHM24-80GDD1EWCQF, DHM24-A60DD1ECCQF, DHM24-A60DD1EWCQF, DHM28-20GDD1ECCDF, DHM28-20GDD1EWCDF, DHM28-40GDD1ECCQF, DHM28-40GDD1EWCQF, DHM28-40GDD1KCADL, DHM28-80GDD1ECCQF, DHM28-80GDD1EWCQF, DHM28-80GDD1KCAQL, DHM28-A60DD1ECCQF, DHM28-A60DD1EWCQF, DHM28-A60DD1KCAQL, DHM28-D2GDD1ECCQF, DHM28-D2GDD1EWCQF
|
| Note Document: | Innodisk [EOL_F240043-14] PCIe 3TE6 Controller Series EOL Notice.pdf |
| Product Change Notification (PCN) | |
| Description This PCN is being issued to address that Innodisk M.2 P80/P42 SSD 3TE6 are going to upgrade product firmware (F/W) and add pull high resistors of pin 50 of M.2. And The PCN will affect standard part number only. (Note: KX bics5 cTLC has been effective on F2318) Desc. Note The FW is able to do DLMC from V22620 to V23701 in condition that SSD is regarded as data drive. Summary of Change 1.Improve warm boot flow 2.Optimize PCIe link. 3.Improve power¬on initialization process after abnormal power‐off. 4.Improve linux compatibility(Linux Ubuntu kernel V5.19) 5.Add pull high resistors to the PERST signal on M.2 Pin 50 to comply with PCI Express M.2 specifications Note: Seq. and Rnd. Read of M.2 P42 1TB and M.2 P80 2TB will be lower than previous FW version. | |
| Revision: | F2360 |
| Revision date: | 13. Dezember 2023 |
| Last purchase date: | 22. März 2024 |
| Last shipping date: | |
| Affected Products: |
DEM24-01TDD1ECAQF, DEM24-01TDD1ECCQF, DEM24-01TDD1EWAQF, DEM24-01TDD1EWCQF, DEM24-01TDD1GCAQF, DEM24-01TDD1GWAQF, DEM24-01TDD1KCAQL, DEM24-01TDD1KWAQF, DEM24-01TDD1KWCDF, DEM24-01TDD1KWCQF, DEM24-64GDD1ECADF, DEM24-64GDD1ECCDF, DEM24-64GDD1EWADF, DEM24-64GDD1EWCDF, DEM24-64GDD1KWCQF, DEM24-A28DD1ECAQF, DEM24-A28DD1ECCQF, DEM24-A28DD1EWAQF, DEM24-A28DD1EWCQF, DEM24-A28DD1GCADF, DEM24-A28DD1GWADF, DEM24-A28DD1KCADL, DEM24-A28DD1KWADF, DEM24-A28DD1KWCDF, DEM24-A28DD1KWCQF, DEM24-B56DD1ECAQF, DEM24-B56DD1ECCQF, DEM24-B56DD1EWAQF, DEM24-B56DD1EWCQF, DEM24-B56DD1GCAQF, DEM24-B56DD1GWAQF, DEM24-B56DD1KCADL, DEM24-B56DD1KCAQL, DEM24-B56DD1KWAQF, DEM24-B56DD1KWCDF, DEM24-B56DD1KWCQF, DEM24-C12DD1ECAQF, DEM24-C12DD1ECCQF, DEM24-C12DD1EWAQF, DEM24-C12DD1EWCQF, DEM24-C12DD1GCAQF, DEM24-C12DD1GWAQF, DEM24-C12DD1KCAQL, DEM24-C12DD1KWAQF, DEM24-C12DD1KWCDF, DEM24-C12DD1KWCQF, DEM28-01TDD1ECAQF, DEM28-01TDD1ECCQF, DEM28-01TDD1EWAQF, DEM28-01TDD1EWCQF, DEM28-01TDD1GCAQF, DEM28-01TDD1GWAQF, DEM28-01TDD1KCAQL, DEM28-01TDD1KWAQF, DEM28-01TDD1KWCQF, DEM28-02TDD1ECAQF, DEM28-02TDD1ECCDF, DEM28-02TDD1ECCQF, DEM28-02TDD1EWAQF, DEM28-02TDD1EWCDF, DEM28-02TDD1EWCQF, DEM28-02TDD1GCAQF, DEM28-02TDD1GWAQF, DEM28-02TDD1KWAQF, DEM28-02TDD1KWCDF, DEM28-02TDD1KWCQF, DEM28-64GDD1ECADF, DEM28-64GDD1ECCDF, DEM28-64GDD1EWADF, DEM28-64GDD1EWCDF, DEM28-A28DD1ECAQF, DEM28-A28DD1ECCQF, DEM28-A28DD1EWAQF, DEM28-A28DD1EWCQF, DEM28-A28DD1GCADF, DEM28-A28DD1GWADF, DEM28-A28DD1KCADL, DEM28-A28DD1KWADF, DEM28-A28DD1KWCDF, DEM28-B56DD1ECAQF, DEM28-B56DD1ECCQF, DEM28-B56DD1EWAQF, DEM28-B56DD1EWCQF, DEM28-B56DD1GCAQF, DEM28-B56DD1GWAQF, DEM28-B56DD1KCADL, DEM28-B56DD1KCAQL, DEM28-B56DD1KWAQF, DEM28-B56DD1KWCQF, DEM28-C12DD1ECAQF, DEM28-C12DD1ECCQF, DEM28-C12DD1EWAQF, DEM28-C12DD1EWCQF, DEM28-C12DD1GCAQF, DEM28-C12DD1GWAQF, DEM28-C12DD1KCAQL, DEM28-C12DD1KWAQF, DEM28-C12DD1KWCQF
|
| Note Document: | [PCN_F2360] Firmware update of 3TE6 series.pdf |
| End of Life (EOL) | |
| Kioxia BiCS4 (96 Layers) Flash Relevant Product Notice NCNR Innodisk hereby announces that we will discontinue all Kioxia BiCS4 (96 Layers) relevant flash products going forward. The products listed below would be phased out of production with milestone dates as below! | |
| Revision: | F2310 |
| Revision date: | 14. Dezember 2023 |
| Last purchase date: | 14. März 2024 |
| Last shipping date: | 14. Juni 2024 |
| Affected Products: |
DEM24-01TDD1GCAQF, DEM24-01TDD1GWAQF, DEM24-A28DD1GCADF, DEM24-A28DD1GWADF, DEM24-B56DD1GCAQF, DEM24-B56DD1GWAQF, DEM24-C12DD1GCAQF, DEM24-C12DD1GWAQF, DEM28-01TDD1GCAQF, DEM28-01TDD1GWAQF, DEM28-02TDD1GCAQF, DEM28-02TDD1GWAQF, DEM28-A28DD1GCADF, DEM28-A28DD1GWADF, DEM28-B56DD1GCAQF, DEM28-B56DD1GWAQF, DEM28-C12DD1GCAQF, DEM28-C12DD1GWAQF, DGM28-01TDA1GCAEF, DGM28-02TDA1GCAEF, DGM28-B56DA1GCAQF, DGM28-C12DA1GCAEF
|
| Note Document: | [EOL_F2310] Kioxia BiCS4 (96 Layers) Flash Relevant Product Notice.pdf |
| Product Change Notification (PCN) | |
| Description This PCN is being issued to address that Innodisk M.2 P80/P42 SSD 3TE6 are going to upgrade product firmware (F/W) and add pull high resistors of pin 50 of M.2. Summary of Change 1.Improve warm boot flow 2.Optimize PCIe link. 3.Improve power¬on initialization process after abnormal power off. 4.Improve linux compability(Linux ubuntu kernel V5.19) 5.Add pull‐high resistors to the PERST signal on M.2 Pin 50 to comply with PCI Express M.2 specifications Note: Seq. and Rnd. read of M.2 P42 1TB and M.2 P80 2TB will be lower than privous FW because of specfic confiruration. | |
| Revision: | F2318 |
| Revision date: | 6. November 2023 |
| Last purchase date: | 8. Dezember 2023 |
| Last shipping date: | |
| Affected Products: |
DEM24-01TDD1KCAQF, DEM24-01TDD1KCCDF, DEM24-01TDD1KCCQF, DEM24-64GDD1KCCQF, DEM24-A28DD1KCADF, DEM24-A28DD1KCCDF, DEM24-A28DD1KCCQF, DEM24-B56DD1KCAQF, DEM24-B56DD1KCCDF, DEM24-B56DD1KCCQF, DEM24-C12DD1KCAQF, DEM24-C12DD1KCCDF, DEM24-C12DD1KCCQF, DEM28-01TDD1KCAQF, DEM28-01TDD1KCCQF, DEM28-02TDD1KCAQF, DEM28-02TDD1KCCDF, DEM28-02TDD1KCCQF, DEM28-A28DD1KCADF, DEM28-A28DD1KCCDF, DEM28-B56DD1KCAQF, DEM28-B56DD1KCCQF, DEM28-C12DD1KCAQF, DEM28-C12DD1KCCQF
|
| Note Document: | [PCN_F2318] Firmware update of 3TE6 series (KX Bics5 cTLC).pdf |
| Product Change Notification (PCN) | |
| Description: This PCN is being issued to address that Innodisk PCIe 3TE6 Series are going to have product firmware (F/W) update. And FW version will be V22620 Summary of Change 1.Optimize bad block management 2.Optimize block refresh condition 3.Improve trim efficiency 4.Imporve read retry flow 5.Support New linux OS 6.Optimize Download micro code condition 7.Support New NAND composition | |
| Revision: | F2241 |
| Revision date: | 26. September 2022 |
| Last purchase date: | 6. Januar 2023 |
| Last shipping date: | |
| Affected Products: |
DECFX-01TDD1ECADFW, DECFX-01TDD1ECAQF, DECFX-01TDD1ECAQFW, DECFX-01TDD1EWADFW, DECFX-01TDD1EWAQF, DECFX-01TDD1EWAQFW, DECFX-01TDD1KCAQF, DECFX-01TDD1KCAQFW, DECFX-64GDD1ECADF, DECFX-64GDD1ECADFW, DECFX-64GDD1ECAQFW, DECFX-64GDD1EWADF, DECFX-64GDD1EWADFW, DECFX-64GDD1EWAQFW, DECFX-A28DD1ECADFW, DECFX-A28DD1ECAQF, DECFX-A28DD1ECAQFW, DECFX-A28DD1EWADFW, DECFX-A28DD1EWAQF, DECFX-A28DD1EWAQFW, DECFX-A28DD1KCADF, DECFX-A28DD1KCADFW, DECFX-A28DD1KCAQFW, DECFX-B56DD1ECADFW, DECFX-B56DD1ECAQF, DECFX-B56DD1ECAQFW, DECFX-B56DD1EWADFW, DECFX-B56DD1EWAQF, DECFX-B56DD1EWAQFW, DECFX-B56DD1KCAQF, DECFX-B56DD1KCAQFW, DECFX-C12DD1ECADFW, DECFX-C12DD1ECAQF, DECFX-C12DD1ECAQFW, DECFX-C12DD1EWADFW, DECFX-C12DD1EWAQF, DECFX-C12DD1EWAQFW, DECFX-C12DD1KCAQF, DECFX-C12DD1KCAQFW, DEM24-01TDD1ECAQF, DEM24-01TDD1ECCQF, DEM24-01TDD1EWAQF, DEM24-01TDD1EWCQF, DEM24-01TDD1GCAQF, DEM24-01TDD1GWAQF, DEM24-01TDD1KCAQF, DEM24-01TDD1KCCDF, DEM24-01TDD1KCCQF, DEM24-64GDD1ECADF, DEM24-64GDD1ECCDF, DEM24-64GDD1EWADF, DEM24-64GDD1EWCDF, DEM24-64GDD1KCCDF, DEM24-64GDD1KCCQF, DEM24-A28DD1ECAQF, DEM24-A28DD1ECCQF, DEM24-A28DD1EWAQF, DEM24-A28DD1EWCQF, DEM24-A28DD1GCADF, DEM24-A28DD1GWADF, DEM24-A28DD1KCADF, DEM24-A28DD1KCCDF, DEM24-A28DD1KCCQF, DEM24-B56DD1ECAQF, DEM24-B56DD1ECCQF, DEM24-B56DD1EWAQF, DEM24-B56DD1EWCQF, DEM24-B56DD1GCAQF, DEM24-B56DD1GWAQF, DEM24-B56DD1KCAQF, DEM24-B56DD1KCCDF, DEM24-B56DD1KCCQF, DEM24-C12DD1ECAQF, DEM24-C12DD1ECCQF, DEM24-C12DD1EWAQF, DEM24-C12DD1EWCQF, DEM24-C12DD1GCAQF, DEM24-C12DD1GWAQF, DEM24-C12DD1KCAQF, DEM24-C12DD1KCCDF, DEM24-C12DD1KCCQF, DEM28-01TDD1GCAQF, DEM28-01TDD1GWAQF, DEM28-01TDD1KCADF, DEM28-01TDD1KCAQF, DEM28-01TDD1KCCQF, DEM28-02TDD1GCAQF, DEM28-02TDD1GWAQF, DEM28-02TDD1KCAQF, DEM28-02TDD1KCCDF, DEM28-02TDD1KCCQF, DEM28-64GDD1KCADF, DEM28-64GDD1KCAQF, DEM28-A28DD1GCADF, DEM28-A28DD1GWADF, DEM28-A28DD1KCADF, DEM28-A28DD1KCAQF, DEM28-A28DD1KCCDF, DEM28-B56DD1GCAQF, DEM28-B56DD1GWAQF, DEM28-B56DD1KCADF, DEM28-B56DD1KCAQF, DEM28-B56DD1KCCQF, DEM28-C12DD1GCAQF, DEM28-C12DD1GWAQF, DEM28-C12DD1KCADF, DEM28-C12DD1KCAQF, DEM28-C12DD1KCCQF
|
| Note Document: | [PCN_F2241] PCIe 3TE6 Firmware Update.pdf |
Innodisk DEM24-01TDD1ECAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
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M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
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| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 1 TB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-01TDD1EWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
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M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
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| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 1 TB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-01TDD1GCAQF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
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M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
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| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 1 TB | ||
| Channel | 4 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-01TDD1GWAQF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
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M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
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||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 1 TB | ||
| Channel | 4 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-01TDD1KCAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 1 TB | ||
| Channel | 4 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-01TDD1KWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 1 TB | ||
| Channel | 4 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-64GDD1ECADF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 64 GB | ||
| Channel | 2 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-64GDD1EWADF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 64 GB | ||
| Channel | 2 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-A28DD1ECAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 128 GB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-A28DD1EWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 128 GB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-A28DD1GCADF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 128 GB | ||
| Channel | 2 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-A28DD1GWADF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 128 GB | ||
| Channel | 2 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-A28DD1KCADF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 128 GB | ||
| Channel | 2 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-A28DD1KWADF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 128 GB | ||
| Channel | 2 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-B56DD1ECAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 256 GB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-B56DD1EWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 256 GB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-B56DD1GCAQF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 256 GB | ||
| Channel | 4 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-B56DD1GWAQF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 256 GB | ||
| Channel | 4 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-B56DD1KCAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 256 GB | ||
| Channel | 4 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-B56DD1KWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 256 GB | ||
| Channel | 4 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-C12DD1ECAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 512 GB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-C12DD1EWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 512 GB | ||
| Channel | 4 | |||
| Flash mode | 64-layer 3D flash (BiCS3 / B16 / B17) | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-C12DD1GCAQF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 512 GB | ||
| Channel | 4 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-C12DD1GWAQF (EOL) (Attention EOL: LTB 14.03.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 512 GB | ||
| Channel | 4 | |||
| Flash mode | 96-Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-C12DD1KCAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, 0°C to 70°C
|
||||
| Mechanical / Environment | Temperature | Operation | 0°C to 70°C | |
| Dimensions | Height | 1,35 mm | ||
| Flash storage media | Capacity | 512 GB | ||
| Channel | 4 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
Innodisk DEM24-C12DD1KWAQF (EOL) (Attention EOL: LTB 01.12.2024) View full datasheet Close datasheet Price: please log in here
|
||||
|
M.2, Kioxia 3D TLC, PCI Express Gen. 3, 3TE6, -40°C to 85°C
|
||||
| Mechanical / Environment | Temperature | Operation | -40°C to 85°C | |
| Dimensions | Height | 1,95 mm | ||
| Flash storage media | Capacity | 512 GB | ||
| Channel | 4 | |||
| Flash mode | 112/128 Layer 3D Flash | |||
| chip enclosure | BGA (Ball Grid Array) A | |||
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